New 700-Nit Near Sunlight
Readable 6.4” VGA Digital TFT
Display ATM6448C-NLW-FBD

Features:

• 6.4” digital TFT LCD panel
• TTL interface
• 640xRGBx480 (“VGA”) pixel resolution
• 700 cd/m2 (typ) brightness (near sunlight readable)
• “Stripe” pixel configuration of color filter
• Overall Size 159.0 x 117.0 mm
• Viewing Area 135.2 x 102.2 mm
• Operating temperature 0 C to +60 C, storage temperature -20C to +70C
• 7.97W (typ at 11.07V) Power Consumption for White LED backlight
• Built-in T-CON/Timing IC (for proper timing signals)
• Optional touch screen

New 12.1 inch Super-Wide Viewing Angle Digital Color TFT LCD p/n PD121SL1

Features:

• Digital active matrix TFT panel
• 12.1” diagonal viewing area
• 800xRGBx600 (SVGA) pixel resolution
• “Stripe” pixel configuration
• Module Size 260.5 (W) x 204.0 (H) x 12.17 (T) mm
• Active Area 246.0 (W) x 184.5 (H) mm
• Operating temperature -30 C to +70 C, storage temperature -40C to +80C
• Power Supply Voltage (Vcc) 3.3V or 5.0V (typical)
• Double CCFL backlight
• LVDS interface
• 1000:1 contrast ratio
• 450 cd/m2 brightness
• Reversible scan

New 1000-Nit Sunlight Readable 3.5 Inch QVGA and VGA Digital TFT Displays ATM3224K-NLW-FBD and ATM6448B-NLW-FBH

Features:

• 3.5” sunlight readable TFT LCD panels
• 1000 (typ) cd/m2 brightness
• Digital RGB interface
• Pixel resolution of 320x234 (QVGA) or 640x480 (VGA)
• Approx. Overall Size 84.25 x 65.24 x 5.8 mm
• Approx. Viewing Area 75.00 x 55.56 mm
• Operating temperature -0 C to +60 C, storage temperature -20C to +70C
• 1.3W (typ at 11.5V, 110mA) power consumption for white LED backlight
• Optional touch screen

500 Series Magnetic Encoder

The Electroswitch 500 Series Magnetic Encoders are built upon a contact free integrated circuit design. This encoder integrates Hall Effect sensing and digital signal processing to provide high-resolution angular measurement solutions.

An important advantage of the 500 Series is the dramatic reduction in package size to ½ inch, while still incorporating the performance and output options required to support the widest range of industrial and motion sensing applications.

The 500 Series design leverages its reduced part count and simplified construction to provide extremely robust, high shock and vibration resistant performance, excelling in harsh and dirty environments. More

KMMX Series
Micro Universal Serial Bus

• More compact footprint than the mini-USB
• Meets the USB Implementers Forum Specification, Which supports the USB On-The-Go (OTG)
• Stainless steel shell, which yields more than 10,000 insertion cycles
• Micro USBs are used in portable devices such as mobile phones, PDAs, and digital cameras.
• More

K050DPX/K050DSX
0.5mm Board to Board

• Mating Height as low as 1.5mm - 6.5mm
• Allows for more cost-efficient and space-saving solutions
• Used in digital cameras, mobile phones, and MP3 players.
• Surface mount plug and socket
• Circuit sizes range from 10-120
• More

CENT1120
Universal 120 Watt Series

• 100-240 VAC Universal Input
• Desktop Style
• Complies with EMI/RFI Regulations
• CE Compliant (LVD, EMC, WEEE, RoHS)
• Impact Resistant, Non-vented Polycarbonate Enclosure
• IPX1 Compliant
• Modified and Custom Designs also Available
• Meets ENERGY STAR Criteria Level IV and EISA Requirements — see page three for details

PW135KBU
Universal 120 Watt Series

• 100-240 VAC Universal Input
• Desktop Style
• Single Output to 40W
• Five Models Available; 12V to 48V
• Regulated Output with Low Ripple
• Impact Resistant Polycarbonate Enclosure
• Modified and Custom Designs Also Available
• Designed to Meet EISA Requirements - see reverse side for details

GNT200

• 200 watts in an industry standard footprint
• ITE/commercial and medical families available
• More

GNT400

• Compact, 1U compatible universal input
• Suitable for a wide range of ITE/commercial or medical applications up to 400 watts
• More

X2Y® Filter and Decoupling Capacitors

Today's circuit designs must maintain Signal Integrity amid increasing Electro-Magnetic Compliance (EMC) requirements, while at the same time lowering system costs. X2Y® Technology is an enabler to this end, providing a quantum leap in circuit performance.

X2Y® replaces multiple standard passives and Integrated Passive Components with a single device, freeing precious board space for additional active components or design miniaturization. In short, X2Y® gives end-users the cost advantage they need to compete in today's market.

Read more about X2Y® Filter & Decoupling Capacitors

LARGE AIRFLOW & HIGH STATIC PRESSURE
The fans feature the large airflow and high static pressure of ranked top in its size.
• Maximum airflow : increased by approx. 40 %
• Maximum static pressure : increased by approx. 115 %
Compared with our conventional product*.

ENERGY-SAVING DESIGN
Power consumption is reduced by approx. 16 % with airflow performance that is identical to our conventional product*.
It is one of the best in the industry.

*Our conventional product is the DC cooling fan:80 mm square × 25 mm thick fan
“ San Ace 80 ”(109R0812G401)

Large airflow and high static pressure
The fans feature the large air flow and high static pressure of ranked top in its size.
- Maximum airflow : increased by approx. 17 %
- Maximum static pressure : increased by approx. 42 %
Compared with our conventional product *.

Energy-Saving Design
Power consumption is reduced by approx. 18 % with airflow performance that is identical to our conventional product*. It is one of the best in the industry.
*Our conventional product is the DC cooling fan : 60 mm square × 38 mm thick fan “San Ace 60” G type (9G0612G102)

Interposers from Advanced Enable Use of Lead-free BGA Devices in Traditional Tin/Lead Reflow Profiles

New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages. Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.

PAD100 series of High Power Operational Amplifiers

The PAD amplifiers are designed for high power industrial applications. With an integrated heat sink and fan, they are a complete power amplifier solution. With voltages to 500V and peak output current of 40 amps, the PAD series are an economical solution for your high power requirements.